Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism
نویسندگان
چکیده
منابع مشابه
The Reliability Analysis and Structure Design for the Fine Pitch Flip Chip BGA Packaging
. Graduate Assistant, Ph.D candidate 2 . Corresponding Author, Professor, Dept. of Power Mechanical Engineering, National Tsing Hua University Abstract The flip chip packaging structure design and the fabrication process parameters will influence the packaging reliability and the performance of chip heat dissipation. The reliability of a flip chip package depends on the packaging structure desi...
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عنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015